Lightweight Design of Fiber Optic Sensors

In aerospace, how can the weight of metal packaging be further reduced?

In aerospace applications, reducing sensor weight is critical. While metal packaging provides robustness and high-temperature resistance, further weight reduction can be achieved by exploring alternative packaging materials.

One approach is to utilize lighter, high-performance polymer encapsulations. For instance, the OFSCN® Polymer-encapsulated Fiber Bragg Grating Strain Sensor offers a lightweight design. These sensors are particularly suitable for applications where minimizing mass is paramount and the operating environment is within the polymer’s temperature limits.

It is crucial to consider the operating temperature range when selecting packaging materials, as polymer-encapsulated sensors generally have a more limited temperature tolerance compared to specialized metal packaging. For extremely high-temperature aerospace environments, engineers might investigate advanced lightweight alloys or optimized thin-wall designs for metal packaging to balance durability and weight.

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